NUMERICAL STUDY OF THIN FILM OXIDE EFFECT WITH MULTIPHYSICS COUPLING ON ELECTRICAL CONTACT PARAMETERS UNDER LOW FORCE

Authors

  • Hans Essone Obame Laboratoire Pluridisciplinaire de Sciences (LAPLUS), Ecole Normale Supérieure, BP :17009, Libreville, Gabon
  • Honoré Gnanga Laboratoire Pluridisciplinaire de Sciences (LAPLUS), Ecole Normale Supérieure, BP :17009, Libreville, Gabon
  • Arsène Eya’a Mvongbote Laboratoire Pluridisciplinaire de Sciences (LAPLUS), Ecole Normale Supérieure, BP :17009, Libreville, Gabon

DOI:

https://doi.org/10.4314/jfas.1357

Keywords:

Electrical contact, thin film oxide, finite elements model, multiphysics coupling

Abstract

Electrical contacts consist of parts where the surfaces in contact can carry electrical current just in a few contact asperity points scattered over the entire apparent contact area. Contamination and oxidation are inevitable on contact surfaces, especially for small contact under low force (mN). This oxidation phenomenon is accelerating by harsh environments (high temperature and high relative humidity RH), making then a thin film oxide on the interface. According to oxide thickness, the electrical resistance will varies allowing then a contact dysfunction. A finite element model has been used to study the multiphysics of thermo electromechanical phenomena and to analyze different cases and various physical parameters. The influence of contact structure on contact resistance was analyzed and the constriction resistance was extracted from measured resistance using a sample numerical simulation.

Downloads

Download data is not yet available.

References

Kogut, L., Electrical performance of contaminated rough surfaces in contact. Journal of Applied Physics, 2005, 97(10), 103723.

Nabeta, Y., Saitoh, Y., Sawada, S., Iida, K., Hattori, Y, and Tamai, T., “Growth of oxide film on the tin-plated surface of connector contacts and its effect contact resistance characteristic,” IEICE Technical Report, EMD2009-100, 2009, pp. 133-136.

El Abdi, R., Benjemaa, N., Study of contact resistance for high copper alloys under indentation and insertion forces, International Journal of Systems Applications, Engineering & Development, 2008, 2(2)

Liu, H., Leray, D., Colin, S., Pons, P., Finite element modeling of nickel oxide film for Au-Ni contact of MEMS switches.61st IEEE Holm Conference on Electrical Contacts, Oct 2015, San Diego, United States.

Holm, R., Electric Contacts, Stockholm: Almqvist & Wiksells Akademiska Handböcker, 1946, pp. 7-23.

Read; M. B., Lang, J. H., Slocum; A. H., Martens, R., “Contact Resistance in Flat-on-Flat and Sphere-on-Flat Thin Films, Proceedings of the 56 IEEE Holm Conference on Electrical Contacts, 2010, pp.348-355.

Holm, R., Electrical Contacts - Theory and Applications, 4th Ed., Springer-Verlag, Berlin 1967

Zhong, L., Fan, X., Han, K., Chen, W., Qian, P., A degradation model for separable electrical contacts based on the failure caused by surface oxide film, Microelectronics Reliability, 2022; 139, 114832

Wang, J-P., Cho, W. D., Oxidation Behavior of Pure Copper in Oxygen and/or Water Vapor at Intermediate Temperature, ISIJ International, Vol. 49, 2009, No. 12, pp. 1926–1931.

Greenwood, J. A.,“Constriction resistance and real area of contact,” Brit. J. Appl. Phys., vol. 17, 1966, pp. 1621-1632.

Slade, P.G., Electrical Contacts - Principles and Applications, Marcel Dekker, New York 1999

Braunovic, M., Konchits, V., Myshkin, N., Electrical Contacts - Fundamentals, Application and Technology, CRC Press Taylor Francis Group, 2007

COMSOL Multiphysics 5.5: User’s Guide

Wei Cheng, S., Chen, B.-S., Jian, S.-R., Hu , Y.-M., Le, P. H., Tuyen, L. T. C., Lee, J.-W. and Juang, J.-Y., Finite Element Analysis of Nanoindentation Responses in Bi2Se3 Thin Films, Coatings, 2022, 12(10), 1554

Lindholm, P., Svahn, F., “Study of thickness dependence of sputtered carbon coating for low friction valve lifters”, Wear, 2006, 261 (3-4), pp. 241-250,

Korzhavyi, P. A., Johansson, B., Literature review on the properties of cuprous oxide Cu2O and the process of copper oxidation, Technical Report, TR-11-08, October 2011

Downloads

Published

2024-01-02

How to Cite

ESSONE OBAME, H.; GNANGA, H. .; EYA’A MVONGBOTE , A. . NUMERICAL STUDY OF THIN FILM OXIDE EFFECT WITH MULTIPHYSICS COUPLING ON ELECTRICAL CONTACT PARAMETERS UNDER LOW FORCE. Journal of Fundamental and Applied Sciences, [S. l.], v. 16, n. 1, p. 92–108, 2024. DOI: 10.4314/jfas.1357. Disponível em: https://www.jfas.info/index.php/JFAS/article/view/1357. Acesso em: 16 may. 2025.

Issue

Section

Articles